Specifications Table – Thermoplastic Adhesive Films for Electronics Industry
Specifications Table – Thermoplastic Adhesive Films for Electronics Industry
| Product Name | Hardness (A) | Flow Temperature (°C) (Rheometer RDA-2) | Recommended Processing Conditions (°C_kg/cm²_sec) | Suitable Substrates |
|---|---|---|---|---|
| EH-932 | 90–95 | 125 ± 5°C | 140°C _ 2 kg/cm² _ 60 sec | PP, Metal |
| EH-937 | 90–95 | 110 ± 5°C | 130°C _ 2 kg/cm² _ 60 sec | PE, Metal |
| EH-943 | 90–95 | 108 ± 5°C | 120°C _ 2 kg/cm² _ 60 sec | PE, Metal |
| EH-346 | 82–88 | 115 ± 5°C | 130°C _ 2 kg/cm² _ 60 sec | Fabric, Metal |
| EH-347 | 75–80 | 100 ± 5°C | 130°C _ 2 kg/cm² _ 60 sec | PE, Metal (Optimal for Cu) |
| EH-349 | 90–95 | 105 ± 5°C | 130°C _ 2 kg/cm² _ 30 sec | Bulletproof vests & helmets, Kevlar, Aramid, Carbon fiber |