Thermoplastic Adhesive Films｜High-Performance Bonding Solutions for the Electronics Industry

Our EH Series thermoplastic adhesive films are specifically developed for high-strength bonding between dissimilar materials in electronics manufacturing. These films offer excellent heat resistance, elongation, and controlled flow properties, making them highly reliable in processes such as flat-panel lamination.

Common applications include:

Lamination of aluminum-plastic composite panels and galvanized steel sheets

Bonding and fixing of smartphone structural components and internal modules

Adhesion between metals (such as aluminum, copper, stainless steel) and engineering plastics (e.g., PP, PE) in electronic component fabrication

The EH Series offers a variety of melting points and hardness options to suit different bonding temperatures, initial tack requirements, and processing conditions—making it an efficient solution for improving both production throughput and product reliability in electronics assembly.