Adhesive Films for the Semiconductor Industry｜Essential Materials for Precision Processing

We offer a range of specialized adhesive film products tailored to the various stages of semiconductor manufacturing, helping our clients improve process stability and product yield. Key applications include:

Wafer Back Grinding (BG) Tape: Protects wafer surfaces and structures during thinning processes, preventing contamination and damage.

Panel-Level Packaging (PLP) Solder Ball Protection Film: Used in advanced packaging processes to prevent displacement or damage of solder balls during handling and processing.

High-Temperature Debondable Liquid Adhesive: Provides strong adhesion at high temperatures and can be cleanly removed at lower temperatures, making it ideal for chip securing and precision dicing processes.

These products provide stable, clean, and controllable temporary bonding and protection solutions for advanced packaging and wafer processing, making them key materials for improving yield and efficiency in next-generation semiconductor manufacturing.