Wafer Back Grinding Tape 

BG Tape is a critical protective material used during the wafer thinning and grinding process in semiconductor manufacturing. As semiconductor devices continue to shrink in size and adopt high-density packaging, wafers often undergo back grinding to reduce thickness, save space, and improve thermal performance. Throughout this process, it is essential to protect the delicate microstructures on the wafer’s front side from contamination and mechanical damage—this is where BG Tape plays a vital role.

Key Functions:

• Surface Protection: Prevents grinding slurry and debris from contaminating the wafer surface and bump structures.

• Secure Support: Holds the wafer firmly in place on the grinding platform to ensure processing precision.

• Stress Absorption: Buffers pressure during grinding to reduce the risk of wafer cracks or breakage.

• Easy Debonding: After grinding, the tape can be cleanly removed without UV exposure, leaving no residue or surface damage.

Most BG Tapes in this series utilize a single-layer hot-melt adhesive design and are manufactured without solvents, ensuring both environmental friendliness and process stability. Suitable for a wide range of wafer sizes and thicknesses, BG Tape is an essential protective solution in advanced semiconductor manufacturing.