This high-performance liquid resin adhesive is specially developed for electronic manufacturing processes. It features a unique “heat-to-bond, cool-to-release” dual-function mechanism. When heated during processing, the adhesive becomes tacky, allowing for secure, temporary bonding of components to prevent shifting or scattering during cutting, flipping, or handling—thereby enhancing process precision and yield.
Once the process is complete, simply cooling the material to room temperature (below 30°C) causes the adhesive to lose its tackiness, allowing for clean and easy removal without residue, and without requiring UV exposure or chemical solvents—greatly simplifying production steps.
Typical Applications:
MLCC (Multilayer Ceramic Capacitor) stacking, dicing, and flipping
Wafer processing and temporary die attachment
Precision component handling under high-temperature conditions requiring stable, removable bonding
Thanks to its excellent temperature-responsive bonding behavior and clean debonding properties, this adhesive offers a reliable, efficient solution for temporary bonding needs in semiconductor and electronics processing.