Solar Industry Adhesive Film｜Encapsulation Solution for Perovskite Modules
Our SH-500 thermoplastic adhesive film is specifically developed for the encapsulation of next-generation perovskite solar cell modules, designed to meet the requirements of TFE (Thin Film Encapsulation) processes. Made from polyolefin (TPO), this adhesive film features low-temperature processability, high optical transparency, and excellent gas barrier performance. It effectively prevents moisture and oxygen infiltration, helping extend module lifespan and enhance power conversion efficiency.
SH-500 is ideal for low-temperature lamination conditions (75–85°C), offering strong adhesion, superior dimensional stability, and excellent insulation performance — making it particularly suitable for fragile perovskite module structures.
Key Features:
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High Optical Transparency: 75–85% transmittance across the 280–1100 nm wavelength range, optimizing light absorption efficiency.
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Excellent Insulation: Volume resistivity ≥ 10¹⁵ Ω·cm; breakdown voltage > 200 KV/mm — ideal for high-voltage module environments.
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Superior Barrier Properties: Water vapor transmission rate (WVTR) ≤ 5.0 g/m²·day, providing a highly stable protective layer.
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Low-Temperature Processable: Compatible with heat-sensitive encapsulation layers and flexible solar module architectures.
The SH-500 series offers a reliable, stable, and scalable encapsulation solution for perovskite solar technology, supporting the development of next-generation photovoltaic products with enhanced performance and market competitiveness.
